mcu design/led lantern pcb design and manufacturing

Product Detailed

1.provide high-quality printed circuit board;
2.advanced printed circuit board production line;
3.world-class production line.

Printed Circuit Board Service

Specifications

Product	Single sided to 12 layers PCB
Material	FR1, FR2, CEM1, CEM3, FR4, BT
Board thickness	0.4mm to 3.2mm
Base copper	H oz to 6oz
Min. hole size Min LW/LS	0.3mm 0.1mm(Flash Gold)/0.15mm(HASL)
Aspect ratio	1 : 6
Soldermask	LPI type, Baked type, Peelable mask
Surface finishing	HASL, Flash gold, Immersion gold, Gold finger, Carbon ink

Bow & twist	0.7% (1.5mm board)
Hole size tol.	PTH: +/-0.08mm, NPTH: +/-0.05mm
Hole location tol.	+/-0.05mm
Gold thickness	0.05um to 1.5um
Nickel thickness	1um to 5um

Output capacity

4 Japanese JUKI high speed chip production lines consist of 1 automated printer, 2 high speed chip machines, 1 multi-purpose chip machine and 1 reflow machine.

Daily output of 160,000 chips

control systems in place

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